Aikace-aikace na Foil na Copper a cikin Kundin Chip

Rufin tagullayana ƙara zama mai mahimmanci a cikin marufi na guntu saboda ƙarancin wutar lantarki, ƙarfin zafi, iya aiki, da ƙimar farashi. Anan akwai cikakken bincike na takamaiman aikace-aikacen sa a cikin marufi na guntu:

1. Copper Waya Bonding

• Sauya Wayar Zinariya ko Aluminum: A al'adance, an yi amfani da wayoyi na gwal ko aluminium a cikin marufi don haɗa wutar lantarki ta ciki na guntu zuwa jagororin waje. Koyaya, tare da ci gaba a fasahar sarrafa tagulla da la'akarin farashi, foil ɗin tagulla da wayar tagulla sannu a hankali suna zama zaɓi na yau da kullun. Ƙarfin wutar lantarki na Copper yana da kusan 85-95% na zinariya, amma farashinsa ya kai kusan kashi ɗaya bisa goma, yana mai da shi kyakkyawan zaɓi don babban aiki da ingantaccen tattalin arziki.
• Ingantattun Ayyukan Wutar Lantarki: Copper waya bonding yana ba da ƙananan juriya da mafi kyawun halayen thermal a cikin babban mita da aikace-aikace na yanzu, yadda ya kamata rage asarar wutar lantarki a cikin haɗin gwiwar guntu da inganta aikin lantarki gaba ɗaya. Don haka, yin amfani da foil ɗin tagulla azaman abu mai ɗaukar nauyi a cikin hanyoyin haɗin gwiwa na iya haɓaka ingantaccen marufi da aminci ba tare da ƙara farashi ba.
• Ana amfani dashi a cikin Electrodes da Micro-Bumps: A cikin marufi-chip, guntu yana jujjuya shi don shigar / fitarwa (I / O) pads ɗin da ke saman sa suna da alaƙa kai tsaye zuwa da'irar kan kunshin. Ana amfani da foil ɗin jan ƙarfe don yin na'urori masu auna sigina da ƙananan bumps, waɗanda ake siyar da su kai tsaye zuwa ga ma'auni. Ƙananan juriya na thermal da babban ƙarfin jan ƙarfe yana tabbatar da ingantaccen watsa sigina da iko.
• Amincewa da Gudanar da thermal: Saboda juriya mai kyau ga electromigration da ƙarfin injiniya, jan ƙarfe yana samar da ingantaccen aminci na dogon lokaci a ƙarƙashin sauye-sauyen yanayin zafi da yawa na yanzu. Bugu da ƙari, babban ƙarfin wutar lantarki na tagulla yana taimakawa cikin hanzari ya watsar da zafin da aka samar yayin aikin guntu zuwa ga ma'aunin zafi ko nutsewar zafi, yana haɓaka ikon sarrafa zafin na kunshin.
• Material Firam ɗin jagora: Rufin tagullaana amfani dashi sosai a cikin marufi na firam ɗin gubar, musamman don marufi na na'urar wuta. Firam ɗin jagora yana ba da tallafi na tsari da haɗin wutar lantarki don guntu, yana buƙatar kayan aiki tare da haɓakar haɓakawa da ingantaccen yanayin zafi. Foil ɗin jan ƙarfe ya cika waɗannan buƙatun, yadda ya kamata rage farashin marufi yayin inganta haɓakar zafi da aikin lantarki.
• Dabarun Maganin Sama: A aikace aikace-aikace, tagulla foil sau da yawa jurewa saman jiyya kamar nickel, tin, ko azurfa plating don hana hadawan abu da iskar shaka da kuma inganta solderability. Waɗannan jiyya suna ƙara haɓaka dorewa da amincin faren jan karfe a cikin marufin firam ɗin gubar.
• Abubuwan Gudanarwa a cikin Modulolin Chip Multi-Chip: Fasaha-in-fakitin fasaha ya haɗu da kwakwalwan kwamfuta da yawa da abubuwan da ba a iya amfani da su ba a cikin kunshin guda ɗaya don cimma babban haɗin kai da aikin aiki. Ana amfani da foil ɗin jan ƙarfe don kera da'irori masu haɗin kai na ciki da kuma aiki azaman hanyar gudanarwa na yanzu. Wannan aikace-aikacen yana buƙatar foil na jan karfe don samun babban ƙarfin aiki da halaye masu sira don cimma babban aiki a cikin iyakataccen sarari marufi.
• Aikace-aikacen RF da Millimeter-WaveHar ila yau, murfin jan ƙarfe yana taka muhimmiyar rawa a cikin da'irar watsa sigina mai girma a cikin SiP, musamman a mitar rediyo (RF) da aikace-aikacen mitoci. Ƙananan halaye na asararsa da kyakkyawan aiki yana ba shi damar rage siginar sigina yadda ya kamata da kuma inganta ingantaccen watsawa a cikin waɗannan aikace-aikace masu girma.
• Ana amfani da shi a cikin Sake Rarraba Layer (RDL): A cikin fakitin fan-out, ana amfani da foil tagulla don gina layin sake rarrabawa, fasahar da ke sake rarraba guntu I/O zuwa babban yanki. Babban haɓakawa da mannewa mai kyau na tagulla na jan ƙarfe ya sa ya zama kayan aiki mai kyau don gina matakan sake rarrabawa, ƙara yawan I / O da kuma tallafawa haɗin kai da yawa.
• Rage Girman Girma da Mutuncin Sigina: Aikace-aikacen takarda na jan karfe a cikin sassan sake rarrabawa yana taimakawa wajen rage girman kunshin yayin da inganta ingantaccen watsa sigina da sauri, wanda ke da mahimmanci a cikin na'urorin hannu da aikace-aikacen ƙididdiga masu girma waɗanda ke buƙatar ƙananan marufi masu girma da aiki mafi girma.
• Rukunin Zafin Jafan Tagulla da Tashoshi na thermal: Saboda kyakkyawan yanayin yanayin zafi, ana amfani da foil na jan karfe sau da yawa a cikin magudanar zafi, tashoshi na thermal, da kayan masarufi na thermal a cikin marufi don taimakawa cikin sauri canja wurin zafi da guntu ya haifar zuwa tsarin sanyaya na waje. Wannan aikace-aikacen yana da mahimmanci musamman a cikin kwakwalwan kwamfuta masu ƙarfi da fakiti waɗanda ke buƙatar madaidaicin sarrafa zafin jiki, kamar CPUs, GPUs, da guntuwar sarrafa wutar lantarki.
• Amfani da Ta hanyar Silicon Via (TSV) Fasaha: A cikin fasahar marufi na guntu 2.5D da 3D, ana amfani da foil na jan karfe don ƙirƙirar kayan cikawa ta hanyar siliki, yana ba da haɗin kai tsaye tsakanin kwakwalwan kwamfuta. Babban haɓakawa da aiwatar da tsare-tsaren jan ƙarfe sun sa ya zama abin da aka fi so a cikin waɗannan fasahohin marufi na ci-gaba, suna tallafawa haɗin kai mafi girma da gajerun hanyoyin sigina, don haka haɓaka aikin tsarin gabaɗaya.

2. Kunshin Juyawa

3. Kunshin Tsarin Jagora

4. Tsarin-in-Package (SiP)

5. Marufi-Fita

6. Aikace-aikacen Gudanar da Ƙaƙwalwar Ƙwararrun Ƙirar zafi

7. Advanced Packaging Technologies (kamar 2.5D da 3D Packaging)

Gabaɗaya, aikace-aikacen foil ɗin tagulla a cikin marufi na guntu bai iyakance ga haɗin kai na al'ada da sarrafa zafi ba amma ya haɓaka zuwa fasahar marufi masu tasowa kamar guntu-chip, tsarin-cikin fakiti, fakitin fan-fita, da marufi na 3D. Kaddarorin masu aiki da yawa da kyakkyawan aiki na foil na jan karfe suna taka muhimmiyar rawa wajen haɓaka dogaro, aiki, da ƙimar ƙimar guntu marufi.