Rage Jiyya na Bididdigar Copper Foil: Babban Tsari da Tabbacin Maɓalli don Shafi da Ayyukan Lamination na thermal

Nadi na jan karfeabu ne mai mahimmanci a cikin masana'antar kewayawa ta lantarki, kuma samanta da tsaftar ciki kai tsaye suna ƙayyade amincin matakan ƙasa kamar sutura da lamination na thermal. Wannan labarin yana nazarin tsarin da maganin rage ɓacin rai ke inganta aikin da aka yi birgima daga yanayin samarwa da aikace-aikace. Yin amfani da ainihin bayanai, yana nuna daidaitawar sa zuwa yanayin sarrafa zafin jiki. CIVEN METAL ya haɓaka tsarin lalata mai zurfi na mallakar mallaka wanda ke karya ta hanyar ƙwanƙolin masana'antu, yana ba da babban abin dogaro da kayan foil na tagulla don masana'antar lantarki mai ƙarfi.

1. Jigon Tsarin Ragewa: Cire Dual na Surface da Man shafawa na ciki

1.1 Ragowar Matsalolin Mai a Tsarin Mirgina

Yayin samar da foil ɗin jan ƙarfe na jan ƙarfe, ingots na jan ƙarfe suna fuskantar matakai da yawa na mirgina don samar da kayan foil. Don rage zafi da jujjuyawa, ana amfani da man shafawa (kamar ma'adinan mai da esters na roba) tsakanin rolls datsare tagullafarfajiya. Koyaya, wannan tsari yana haifar da riƙewar maiko ta hanyoyi biyu na farko:

• Surface adsorption: A ƙarƙashin matsin lamba, fim ɗin mai sikelin micron (0.1-0.5μm lokacin farin ciki) yana manne da saman bangon tagulla.
• Shiga ciki: A lokacin mirgina nakasar, lattice na jan karfe yana tasowa ƙananan lahani (kamar dislocations da voids), ƙyale kwayoyin man mai (C12-C18 hydrocarbon sarƙoƙi) su shiga cikin tsare ta hanyar aikin capillary, zuwa zurfin 1-3μm.

1.2 Iyakance Hanyoyin Tsabtace Na Gargajiya

Hanyoyin tsaftacewa na al'ada (misali, wankin alkaline, shafan barasa) cire fina-finan mai kawai, samun nasarar kawar da kusan70-85%, amma ba su da tasiri a kan man shafawa na ciki. Bayanan gwaji sun nuna cewa ba tare da raguwa mai zurfi ba, man shafawa na ciki ya sake fitowa a saman bayanMinti 30 a 150 ° C, tare da sake ajiyar kuɗi na0.8-1.2g/m², yana haifar da "lalacewa ta biyu."

1.3 Nasarar Fasaha A Cikin Zurfin Ragewa

CIVEN METAL yana aiki da a"harar sunadarai + kunnawa ultrasonic"tsarin hadawa:

1. Sinadaran hakar: A al'ada chelating wakili (pH 9.5-10.5) decomposes dogon sarkar man mai kwayoyin halitta, forming ruwa-soluble gidaje.
2. Taimakon Ultrasonic: 40kHz high-mita duban dan tayi haifar da cavitation effects, karya da dauri karfi tsakanin ciki man shafawa da jan ragargaje, inganta maiko rushe yadda ya dace.
3. bushewar bushewa: Rashin ruwa mai sauri a -0.08MPa matsa lamba mara kyau yana hana hadawan abu da iskar shaka.

Wannan tsari yana rage ragowar maiko zuwa≤5mg/m²(gamuwa da ka'idojin IPC-4562 na ≤15mg/m²), cimma> 99% ingancin cirewaga man shafawa na ciki.

2. Tasiri kai tsaye na Maganin Ragewa akan Shafi da Tsarin Lamination na thermal

2.1 Haɓaka mannewa a cikin Aikace-aikacen Rufe

Kayayyakin sutura (kamar PI adhesives da photoresists) dole ne su samar da matakan haɗin kwayoyin halitta tare datsare tagulla. Gurasar mai yana haifar da abubuwa masu zuwa:

• Rage makamashin fuska: A hydrophobicity na man shafawa qara lamba kwana na shafi mafita daga15° zuwa 45°, hana jika.
• Haɗin haɗin sinadarai: Layer na man shafawa yana toshe ƙungiyoyin hydroxyl (-OH) akan saman jan karfe, yana hana haɓakawa tare da ƙungiyoyi masu aiki na guduro.

Kwatancen Ayyuka na Degreased vs. Tsararren Tagulla na yau da kullun:

2.2 Ingantacciyar dogaro a cikin Lamination na thermal

A lokacin babban zafin jiki (180-220 ° C), ragowar mai a cikin tagulla na yau da kullun yana haifar da gazawa da yawa:

• Samuwar kumfa: Tufafin mai yana haifar10-50μm kumfa(yawanci> 50/cm²).
• Interlayer delaminationMan shafawa yana rage karfin van der Waals tsakanin epoxy resin da foil jan karfe, yana rage karfin kwasfa ta30-40%.
• Dielectric hasara: Man shafawa kyauta yana haifar da canjin dielectric akai-akai (bambancin Dk> 0.2).

Bayan1000 hours na 85°C/85% RH tsufa, CIVEN METALTakardun Tagullanuni:

• Yawan kumfa: <5/cm² (matsakaicin masana'antu>30/cm²).
• Ƙarfin kwasfa: Kulawa1.6N/cm(ƙimar farko1.8N/cm, yawan lalacewa kawai 11%).
• Dielectric kwanciyar hankali: Dk bambancin ≤0.05, haduwa5G millimeter-kalaman buƙatun mitar.

3. Matsayin Masana'antu da Matsayin CIVEN METAL's Benchmark

3.1 Kalubalen Masana'antu: Sauƙaƙe Tsari-Tsarin Kuɗi

Ƙarshe90% na masana'antun da aka yi birgima na jan karfesauƙaƙe sarrafawa don rage farashi, bin ainihin tsarin aiki:

Rolling → Wanke Ruwa (Na₂CO₃ mafita) → bushewa → Iska

Wannan hanyar kawai tana kawar da man shafawa na ƙasa, tare da juzu'in juriya na bayan-wanke± 15%(Tsarin CIVEN METAL yana kiyaye ciki± 3%).

3.2 CIVEN METAL's "Zero-Defect" Tsarin Kula da Ingancin

• Sa idanu akan layi: Binciken X-ray fluorescence (XRF) don gano ainihin lokaci na abubuwan da suka rage (S, Cl, da dai sauransu).
• Gaggauta gwajin tsufa: Simulating matsananci200°C/24hyanayi don tabbatar da sake fitowar mai.
• Cikakkun aikin ganowa: Kowane nadi ya ƙunshi lambar QR mai haɗawa zuwa32 key tsari sigogi(misali, rage yawan zafin jiki, ikon ultrasonic).

4. Ƙarshe: Jiyya na Rage-Tsarin Ƙarshen Ƙarshen Ƙarshen Ƙarshen Ƙarshen Ƙwararrun Ƙwararrun Ƙwararrun Ƙarshen

Magani mai zurfi mai zurfi na birgima na tagulla ba wai kawai haɓaka tsari bane amma daidaitawar tunani na gaba zuwa aikace-aikacen gaba. Fasahar nasara ta CIVEN METAL tana haɓaka tsaftar foil ɗin jan ƙarfe zuwa matakin atomic, yana samarwatabbacin matakin kayan abudominHaɗin haɗin kai mai girma (HDI), m da'irori na mota, da sauran manyan filaye.

A cikin5G da AIoT zamanin, kamfanoni ne kawai ke sarrafacore tsaftacewa fasaharzai iya fitar da sabbin abubuwa na gaba a cikin masana'antar tagulla ta lantarki.

(Tsarin Bayanai: CIVEN METAL Technical White Paper V3.2/2023, IPC-4562A-2020 Standard)

Marubuci: Wu XiaoweiRufewar Copper FoilInjiniyan Fasaha, Kwarewar Shekaru 15 na Masana'antu)
Bayanin Haƙƙin mallaka: Bayanai da ƙarshe a cikin wannan labarin sun dogara ne akan sakamakon gwajin gwaji na CIVEN METAL. An haramta haifuwa mara izini.