Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarfafawa

Passivation shine ainihin tsari a cikin samar da birgimatsare tagulla. Yana aiki a matsayin "garkuwar matakin kwayoyin halitta" a saman, yana haɓaka juriya na lalata yayin da a hankali daidaita tasirin sa akan mahimman kaddarorin kamar haɓakawa da solderability. Wannan labarin yana zurfafa cikin ilimin kimiyya bayan hanyoyin wucewa, cinikin aiki, da ayyukan injiniya. AmfaniCVEN METALNasarar da ta samu a matsayin misali, za mu bincika kimarsa ta musamman a masana'antar kera kayan lantarki masu tsayi.

1. Passivation: "Garkuwan Matsayin Kwayoyin Halitta" don Takardun Tagulla

1.1 Yadda Fayil ɗin Passivation Ya Sami
Ta hanyar maganin sinadarai ko electrochemical, ƙaramin oxide Layer 10-50nm mai kauri ya fito a samantsare tagulla. Wanda ya ƙunshi galibin Cu₂O, CuO, da rukunin ƙwayoyin halitta, wannan Layer yana ba da:

• Shingayen Jiki:Matsakaicin yaduwar iskar oxygen yana raguwa zuwa 1 × 10⁻¹⁴ cm²/s (sauka daga 5 × 10⁻⁸ cm²/s don jan karfe).
• Wutar Lantarki:Yawan lalacewa na yanzu yana raguwa daga 10μA/cm² zuwa 0.1μA/cm².
• Rashin Inertness:Ana rage kuzarin da ba ta da ƙarfi daga 72mJ/m² zuwa 35mJ/m², yana danne ɗabi'ar amsawa.

1.2 Muhimman Fa'idodi guda biyar na Cirewa

2. "Takobin Kafi Biyu" na Rubutun Passivation-da Yadda Ake Daidaita Shi.

2.1 Tantance Hatsari

• Rage Rage Ƙarƙashin Ƙarfafawa:Layer passivation yana ƙara zurfin fata (a 10GHz) daga 0.66μm zuwa 0.72μm, amma ta hanyar kiyaye kauri a ƙarƙashin 30nm, haɓaka juriya na iya iyakancewa zuwa ƙasa da 5%.
• Kalubalen siyarwa:Ƙarƙashin ƙarfi na ƙasa yana ƙaruwa da kusurwoyin wetting na solder daga 15 ° zuwa 25 °. Yin amfani da manna mai aiki (nau'in RA) na iya kashe wannan tasirin.
• Matsalolin Adhesion:Ƙarfin haɗin gwiwar guduro na iya raguwa 10-15%, wanda za'a iya ragewa ta hanyar haɗa roughening da tafiyar matakai.

2.2CVEN METALHanyar daidaitawa

Fasahar wucewa ta Gradient:

• Tushen Layer:Girman Electrochemical na 5nm Cu₂O tare da (111) fifikon fifiko.
• Tsakanin Layer:Fim na 2-3nm benzotriazole (BTA) mai haɗa kai.
• Layer na waje:Wakilin haɗin gwiwar Silane (APTES) don haɓaka mannewar guduro.

Ingantattun Sakamakon Ayyuka:

3. CVEN METALFasahar Haɓakawa: Sake Fannin Kariya

3.1 Tsarin Kariya mai hawa huɗu

1. Sarrafa Oxide mai Bakin ciki:Pulse anodization yana samun bambancin kauri tsakanin ± 2nm.
2. Nau'in-Inorganic Hybrid Layers:BTA da silane suna aiki tare don rage yawan lalata zuwa 0.003mm / shekara.
3. Maganin Kunna Surface:Tsaftace Plasma (Gas ɗin Ar/O₂) yana mayar da kusurwoyin jika na solder zuwa 18°.
4. Kulawa na Gaskiya:Ellipsometry yana tabbatar da kauri mai kauri tsakanin ± 0.5nm.

3.2 Matsanancin Tabbatar da Muhalli

• Babban Danshi da Zafi:Bayan sa'o'i 1,000 a 85 ° C/85% RH, juriya na saman yana canzawa da ƙasa da 3%.
• Girgizar zafi:Bayan zagayowar 200 na -55°C zuwa +125°C, babu tsaga da ke bayyana a cikin layin wucewa (tabbatar ta SEM).
• Juriya na Chemical:Juriya zuwa 10% HCl tururi yana ƙaruwa daga mintuna 5 zuwa mintuna 30.

3.3 Daidaituwa Gaba ɗaya Aikace-aikace

• 5G Millimeter-Wave Eriya:An rage asarar shigar 28GHz zuwa 0.17dB/cm kawai (idan aka kwatanta da 0.21dB/cm masu fafatawa).
• Kayan Wutar Lantarki na Mota:Ya wuce gwajin gwajin gishiri na ISO 16750-4, tare da tsawaita hawan keke zuwa 100.
• IC Substrates:Ƙarfin mannewa tare da resin ABF ya kai 1.8N/cm (matsakaicin masana'antu: 1.2N/cm).

4. Future of Passivation Technology

4.1 Fasahar Atomic Layer Deposition (ALD).
Haɓaka finafinan wucewar nanolaminate bisa Al₂O₃/TiO₂:

• Kauri:<5nm, tare da haɓaka juriya ≤1%.
• CAF (Conductive Anodic Filament) Juriya:5x inganta.

4.2 Rarraba Ciwon Kai na Warkar da Kai
Haɗa masu hana lalata microcapsule (masu hana benzimidazole):

• Ingantaccen Warkar da Kai:Sama da 90% a cikin awanni 24 bayan karce.
• Rayuwar Sabis:Tsawaita zuwa shekaru 20 (idan aka kwatanta da daidaitattun shekaru 10-15).

Ƙarshe:
Maganin wucewa yana samun ingantaccen daidaito tsakanin kariya da aiki don birgimatsare tagulla. Ta hanyar kirkire-kirkire,CVEN METALyana rage gazawar wucewa, yana mai da shi “makamai mara ganuwa” wanda ke haɓaka amincin samfur. Yayin da masana'antar lantarki ke motsawa zuwa mafi girma mai yawa da dogaro, daidaitaccen wucewar wuce gona da iri ya zama ginshiƙan kera foil ɗin tagulla.