A fagentsare tagullamasana'antu, roughening bayan jiyya shine mabuɗin tsari don buɗe ƙarfin haɗin haɗin kayan abu. Wannan labarin yana nazarin wajibcin roughening jiyya daga ra'ayoyi uku: sakamako na daidaitawa na inji, hanyoyin aiwatar da tsari, da daidaitawar amfani da ƙarshen. Hakanan yana bincika ƙimar aikace-aikacen wannan fasaha a fannoni kamar sadarwar 5G da sabbin batura masu ƙarfi, dangane daCVEN METAL's fasaha nasarori.
1. Magani mai Raɗaɗi: Daga "Tarko Mai laushi" zuwa "Interface Mai Ƙarfafawa"
1.1 Mummunan Laifukan Fasa Mai Santsi
Asalin rashin ƙarfi (Ra) natsare tagullaFilaye yawanci ƙasa da 0.3μm, wanda ke haifar da batutuwa masu zuwa saboda halayensa kamar madubi:
- Rashin Isasshen Haɗin Jiki: Yankin lamba tare da guduro shine kawai 60-70% na ƙimar ka'idar.
- Abubuwan Haɗin Kan Kemikal: Layer oxide mai yawa (Cu₂O kauri game da 3-5nm) yana hana bayyanar ƙungiyoyi masu aiki.
- Hankalin Damuwa na thermal: Bambance-bambance a cikin CTE (Coefficient of thermal Expansion) na iya haifar da delamination na dubawa (ΔCTE = 12ppm / ° C).
1.2 Mabuɗin Nasara Na Farko guda uku a cikin Tsarukan Ƙarfafawa
Tsari Tsari | Garkuwar Tagulla na Gargajiya | Roughed Copper Foil | Ingantawa |
Surface Roughness Ra (μm) | 0.1-0.3 | 0.8-2.0 | 700-900% |
Takamaiman Yankin saman (m²/g) | 0.05-0.08 | 0.15-0.25 | 200-300% |
Ƙarfin Kwasfa (N/cm) | 0.5-0.7 | 1.2-1.8 | 140-257% |
Ta hanyar ƙirƙira wani tsari mai girma mai girma uku (duba Hoto 1), mai taurin kai ya cimma:
- Matsakaicin Makanikai: Siffofin shigar da guduro "barbed" anchoring (zurfin> 5μm).
- Kunna sinadarai: Bayyana (111) manyan jirage na kristal masu aiki suna ƙara haɓakar rukunin yanar gizon zuwa 10⁵ sites/μm².
- Ƙunƙarar Matsala ta thermal: The porous tsarin sha kan 60% na thermal danniya.
- Hanyar Hanya: Acidic jan plating bayani (CuSO₄ 80g/L, H₂SO₄ 100g/L) + Pulse Electro-zubawa (wakin sake zagayowar 30%, mita 100Hz)
- Siffofin Tsari:
- Tsayin dendrite Copper 1.2-1.8μm, diamita 0.5-1.2μm.
- Abubuwan da ke cikin iskar oxygen ≤200ppm (binciken XPS).
- Juriyar lamba <0.8mΩ·cm².
- Hanyar Hanya: Cobalt-nickel alloy plating bayani (Co²+ 15g/L, Ni²+ 10g/L)
- Siffofin Tsari:
- Girman barbashi na CoNi 0.3-0.8μm, girman girman> 8 × 10⁴ barbashi / mm².
- Oxygen abun ciki ≤150ppm.
- Juriyar lamba <0.5mΩ·cm².
2. Red Oxidation vs. Black Oxidation: Sirrin Tsari Bayan Launuka
2.1 Red Oxidation: Copper's "Armor"
2.2 Black Oxidation: Alloy "Armor"
2.3 Dabarun Kasuwanci Bayan Zaɓin Launi
Ko da yake maɓalli na ayyukan aiki (mannewa da haɓakawa) na ja da baƙar fata oxidation sun bambanta da ƙasa da 10%, kasuwa yana nuna bambanci:
- Janye Oxidized Copper Foil: Lissafi na kashi 60% na kasuwar kasuwa saboda fa'idar tsadarsa mai mahimmanci (12 CNY/m² vs. baki 18 CNY/m²).
- Black Oxidized Copper Foil: Ya mamaye kasuwa mai girma (FPC mai hawa mota, PCBs-milimita-wave) tare da kashi 75% na kasuwa saboda:
- Rage 15% a cikin hasara mai girma (Df = 0.008 vs. ja oxidation 0.0095 a 10GHz).
- 30% inganta CAF (Conductive Anodic Filament) juriya.
3. CVEN METAL: "Nano-Level Masters" na Roughening Technology
3.1 Sabbin Fasahar “Gradient Roughening”
Ta hanyar sarrafa matakai uku,CVEN METALyana inganta tsarin saman (duba hoto 2):
- Nano-Crystalline Seed Layer: Electro-deposition na jan karfe cores 5-10nm a girman, yawa> 1×10¹¹ barbashi/cm².
- Ci gaban Micron Dendrite: Pulse current controls dendrite orientation (fifi fifikon (110) shugabanci).
- Fassara Ƙarfafawa: Organic silane hada guda biyu wakili (APTES) shafi inganta hadawan abu da iskar shaka juriya.
3.2 Aiki Wuce Matsayin Masana'antu
Gwajin Abun | Saukewa: IPC-4562 | CVEN METALBayanan Auna | Amfani |
Ƙarfin Kwasfa (N/cm) | ≥0.8 | 1.5-1.8 | + 87-125% |
Surface Roughness CV Darajar | ≤15% | ≤8% | -47% |
Asarar foda (mg/m²) | ≤0.5 | ≤0.1 | -80% |
Resistance Humidity (h) | 96 (85°C/85% RH) | 240 | +150% |
3.3 Ƙarshen Amfani da Matrix
- 5G Base Station PCB: Yana amfani da baƙar fata oxidized jan karfe (Ra = 1.5μm) don cimma <0.15dB/cm asarar sakawa a 28GHz.
- Masu Tarar Batir: Ja oxidizedtsare tagulla(ƙarfin ƙarfi 380MPa) yana ba da rayuwar zagayowar> zagayowar 2000 (ma'auni na 1500 na ƙasa).
- FPCs Aerospace: Ƙaƙƙarfan Layer yana jure wa zafin zafin jiki daga -196 ° C zuwa + 200 ° C don hawan keke 100 ba tare da lalata ba.
4. Filin Yakin Nan gaba don Rufewar Tagulla
4.1 Fasaha mai Tsari
Don buƙatun sadarwa na 6G terahertz, ana haɓaka tsarin serrated tare da Ra = 3-5μm:
- Dielectric Constant Stability: An inganta zuwa ΔDk <0.01 (1-100GHz).
- Juriya na thermal: An rage shi da 40% (cimma 15W/m·K).
4.2 Smart Roughening Systems
Haɗin gano hangen nesa na AI + daidaitawar tsari mai ƙarfi:
- Kulawa da Salon Sama na Zamani: Samfurin mitar firam 100 a sakan daya.
- Daidaita Maɗaukakin Maɗaukaki na YanzuMatsakaicin ± 0.5A/dm².
Maganin tagulla ya samo asali daga “tsari na zaɓi” zuwa “yawan ayyuka.” Ta hanyar bidi'a na tsari da kuma matsanancin kulawar inganci,CVEN METALya tura fasahar roughening zuwa daidaitaccen matakin atomic, yana ba da tallafin kayan tushe don haɓaka masana'antar lantarki. A nan gaba, a cikin tseren don mafi wayo, mafi girma mita, da ingantattun fasahohi, duk wanda ya ƙware da "lambar matakin ƙaramar fasaha" na fasahar roughening zai mamaye babban matakin dabarun fasaha.tsare tagullamasana'antu.
(Tsarin Bayanai:CVEN METALRahoton Fasaha na Shekara-shekara 2023, IPC-4562A-2020, IEC 61249-2-21)
Lokacin aikawa: Afrilu-01-2025