[VLP] Ƙarƙashin Bayanan Bayani na ED Copper Foil
![[VLP] Ƙarƙashin Bayanan Bayani na ED Mai Kyau Featured Hoton](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil.png)
Gabatarwar Samfur
VLP, foil ɗin tagulla mai ƙarancin ƙima wanda CIVEN METAL ke samarwa yana da halayen ƙarancin ƙarancin ƙarfi da ƙarfin kwasfa. Jaket ɗin jan ƙarfe da tsarin lantarki ya samar yana da fa'idodin tsafta mai ƙarfi, ƙarancin ƙazanta, ƙasa mai santsi, siffar allo, da babban faɗi. The electrolytic jan karfe tsare za a iya mafi alhẽri laminated da wasu kayan bayan roughening a gefe daya, kuma ba shi da sauki kwasfa.
Ƙayyadaddun bayanai
CIVEN na iya samar da ultra-low profile high zafin jiki na ductile electrolytic jan karfe (VLP) daga 1/4oz zuwa 3oz (ƙaramar kauri 9µm zuwa 105µm), kuma matsakaicin girman samfurin shine 1295mm x 1295mm takardar jan karfe.
Ayyuka
CIVEN yana ba da bangon ƙarfe mai kauri na electrolytic mai kauri tare da kyawawan kaddarorin jiki na daidaitaccen kristal mai kyau, ƙarancin martaba, babban ƙarfi da haɓakawa. (Duba Table 1)
Aikace-aikace
Wanda ya dace don kera allunan kewayawa masu ƙarfi da alluna masu ƙarfi don kera motoci, wutar lantarki, sadarwa, soja da sararin samaniya.
Halaye
Kwatanta da irin waɗannan samfuran ƙasashen waje.
1.The hatsi tsarin mu VLP electrolytic jan karfe tsare ne equiaxed lafiya crystal mai siffar zobe; yayin da tsarin hatsi na irin waɗannan samfurori na kasashen waje yana da columnar da tsawo.
2. Electrolytic jan karfe foil ne ultra-low profile, 3oz jan karfe tsare babban surface Rz ≤ 3.5µm; yayin da samfuran ƙasashen waje makamantan su ne daidaitattun bayanan martaba, 3oz jan karfe gross surface Rz> 3.5µm.
Amfani
1.Tun da samfurin mu ne matsananci-low profile, shi solves m hadarin layin gajeren kewaye saboda da babban roughness na misali lokacin farin ciki na jan karfe tsare da kuma sauki shigar azzakari cikin farji na bakin ciki takardar takarda da "wolf hakori" a lokacin da latsa panel mai gefe biyu.
2.Because da hatsi tsarin mu kayayyakin ne equiaxed lafiya crystal mai siffar zobe, shi shortens lokacin line etching da kuma inganta matsalar m line gefen etching.
3, yayin da samun babban kwasfa ƙarfi, babu jan karfe canja wurin foda, bayyananne graphics PCB masana'antu yi.
Aiki (GB/T5230-2000, IPC-4562-2000)
| Rabewa | Naúrar | 9m ku | 12 μm | 18m ku | 35m ku | 70 μm | 105m ku | |
| Cu abun ciki | % | ≥99.8 | ||||||
| Nauyin yanki | g/m2 | 80± 3 | 107± 3 | 153± 5 | 283± 7 | 585± 10 | 875± 15 | |
| Ƙarfin Ƙarfi | RT (23 ℃) | Kg/mm2 | ≥28 | |||||
| HT (180 ℃) | ≥15 | ≥18 | ≥20 | |||||
| Tsawaitawa | RT (23 ℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
| HT (180 ℃) | ≥6.0 | ≥8.0 | ||||||
| Tashin hankali | Shiny (Ra) | μm | ≤0.43 | |||||
| Matte (Rz) | ≤3.5 | |||||||
| Ƙarfin Kwasfa | RT (23 ℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
| Rage darajar HCΦ (18% -1hr/25 ℃) | % | ≤7.0 | ||||||
| Canjin launi (E-1.0hr/200 ℃) | % | Yayi kyau | ||||||
| Solder mai iyo 290 ℃ | Dakika | ≥20 | ||||||
| Bayyanar (Spot da jan karfe foda) | ---- | Babu | ||||||
| Fitowa | EA | Sifili | ||||||
| Haƙuri Girma | Nisa | mm | 0 ~ 2mm | |||||
| Tsawon | mm | ---- | ||||||
| Core | mm/inch | Ciki Diamita 79mm/3 inch | ||||||
Lura:1. Ƙimar Rz na babban bango na jan karfe shine ƙimar tsayayye na gwaji, ba ƙima mai garanti ba.
2. Ƙarfin kwasfa shine daidaitaccen ƙimar gwajin jirgi na FR-4 (5 zanen gado na 7628PP).
3. Lokacin tabbatar da inganci shine kwanaki 90 daga ranar da aka karɓa.
![[RTF] Juya Maganin ED Copper Foil](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
![[BCF] Batir ED Copper Foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[HTE] Babban Elongation ED Copper Foil](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
